500g Copper Metal Foil 99.58% 0.1mm
Product Code: O4e4Mze
General Applications Specification Hazards European Shipments Downloads Additional information
Copper metal foil 0.1mm.
Used in roofing
Structural engineering
EMI/RFI shielding
Circuit boards
Heat exchanging
Minimum Assay: 99.58%
Molecular Formula: Cu
Molecular Formula: 63.55 g/mol
Form: Reddish foil
Boiling Point: 2567 °C(lit.)
Melting Point: 1083.4 °C(lit.)
Resistivity: 1.673 μΩ-cm, 20°C
Thickness: 0.1mm
Hazard Phrases: Not considered harmful under normal laboratory conditions
Cas No: 7440-50-8
Einecs No: 231-159-6
Copper metal foil 0.1mm.
Used in roofing
Structural engineering
EMI/RFI shielding
Circuit boards
Heat exchanging
Minimum Assay: 99.58%
Molecular Formula: Cu
Molecular Formula: 63.55 g/mol
Form: Reddish foil
Boiling Point: 2567 °C(lit.)
Melting Point: 1083.4 °C(lit.)
Resistivity: 1.673 μΩ-cm, 20°C
Thickness: 0.1mm
Hazard Phrases: Not considered harmful under normal laboratory conditions
Cas No: 7440-50-8
Einecs No: 231-159-6
Product Code: O4e4Mze
Product Condition: New
weight: 500.0g
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