Lab Chemicals

Assay (iodometric): 99.0-102.0% Molecular Formula: CrK(SOâ )â 12Hâ O Molecular Weight: 499.41 Melting Point: 89 C Insoluble Matter: 0.01% Chloride (Cl): 0.002% Heavy Metals (as Pb): 0.01% Aluminium (Al):...

Cinnamic acid is an organic compound with the formula C6H5CHCHCO2H. It is a white crystalline compound that is slightly soluble in water. Classified as an unsaturated carboxylic acid, it occurs naturally...

Copper(I) chloride, commonly called cuprous chloride, is the lower chloride of copper, with the formula CuCl. Can be used as a catalyst in a variety of organic reactions Minimum Assay: 97% Assay as Cu...

Copper (I) Oxide 97%

Basic copper carbonate normally refers to the compound (Cu2(OH)2CO3) (the mineral malachite). Sometimes the name is used for Cu3(OH)2(CO3)2 (the related mineral azurite). Malachite and azurite can be found...

Copper(II) chloride has a variety of specialized applications in the synthesis of organic compounds. Minimum Assay: 97% Molecular Formula: CuCl2.2H2O Molecular Weight: 170.48 Iron (Fe): 36.2% Hazard Class:...

Copper(II) oxide or cupric oxide is a finely powdered chemical compound, composed of CuO. With its distinctive black colour, this high-purity compound is widely used in various industries and scientific...

Copper sulphate is the inorganic compound with the chemical formula CuSO4(H2O)x, where x can range from 0 to 5. As a fungicide and herbicide As an analytical reagent In organic synthesis Food Grade Material...

Copper (II) sulphate, also known as cupric sulphate, is the chemical compound with the chemical formula CuSO4. This salt exists as a series of compounds that differ in their degree of hydration. Copper...

Copper (II) sulphate, also known as cupric sulphate, is the chemical compound with the chemical formula CuSO4. This salt exists as a series of compounds that differ in their degree of hydration. Copper...

General Applications Specification Hazards European Shipments Downloads Additional information Copper metal foil 0.1mm. Used in roofing Structural engineering EMI/RFI shielding Circuit boards Heat exchanging...

Minimum Assay: 99.5% Molecular Formula: C6H12O6 Molecular Weight: 180.16 Melting Point: 105-100 C Density: 1.59